Thermal Conductive Adhesive

Overview

Thermal paste is a very high heat conductive paste that is used between two objects (usually a heatsink and a CPU/GPU) to get better heat conduction. It fills in all those microscopic imperfections on the heatsink and CPU/GPU that can trap air in them and cause a loss in the heatsink’s performance.

Specifications

Thermal properties, strong adhesion;
Melting capacity: 0 (200degree celsius/ 24Hours);
Evaporation: 0.001% (200 degree celsius/ 24Hours);
Thermal conductivity: > 1.2W/m-K Thermal;
Impedance: <0.06;
Clotting time: 3min (25 degree celsius);
Insulation coefficient: > 5.1;
Dissipation coefficient: <0.005;
Temperature resistance: 200 degree celsius;